A In the packaging process of semiconductor devices,
glove boxes can provide necessary protection for this delicate process. The packaging process is a key step in ensuring the long-term reliability and stability of the chip, and the glove box can prevent the intrusion of external moisture and impurities during the packaging process, thereby protecting the chip from damage. Especially in some advanced flip chip packaging technologies, the application of glove boxes is particularly evident. In key operations such as welding and bonding, the glove box can ensure that the chip surface is not affected by oxidation and contamination, which is crucial for maintaining the electrical performance of the chip and extending its service life. By providing a dust-free, waterless, and oxygen free working environment, glove boxes not only improve packaging quality, but also reduce subsequent maintenance costs and potential failure risks.